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ASAHITEC's metal masks, laser-processed according to your configuration requirements,
can realize high-stability, high-precision solder printing on printed circuit boards, etc.

 

Opening diameter F0.150
Board thicknessF0.040
Before processing
After processing
Can process with the hole diameter precision of within }3m.

Due to high pitch precision, we can provide masks with comprehensively high
configuration precision.

Due to extremely smooth processing surface and high dimensional precision, the solder applied volume can be uniform and stable. At your request, we can add F2 processing (special secondary processing) to further smooth the processing surface.

we are also handling etching metals masks, additive metal masks, etc.,


Item
Mask material SUS-ROS
Max. processing area

UOOmm~UOOmm

Max. processing metal thickness O.SOOmm
Opening precision Within }Rm (Metal thickness TOm, round hole)
Pitch dimensional precision Within }POm (per pitch QOOm, round hole)
Min. hole diameter ӂQOm


Solder resin filling
Surface mounting of electronic
parts
Bumping on semiconductors
Water level CSP bumping





Contact@eigyou@asahitec-j.co.jp


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